Solder Database
ELFNET – European Lead-Free Soldering Network – has collaborated with COST 531 to deliver a much-needed database of physical and mechanical properties for the new Tin-Silver-Copper (SnAgCu) lead-free solder alloys. This data is key to modeling behavior of lead-free solder joints, that from July 2006 will be at the heart of most electrical and electronic equipment in Europe.
“ELFNET has been bringing together communities of research and industry experts to prioritize lead-free technology implementation issues and develop collaborative solutions.” comments Dr Jeremy Pearce, ELFNET Co-coordinator. “This database represents a key achievement in exploiting expertise in the academic research community to the direct benefit of the electronics industry.”
COST 531 is a network of over 60 universities across Europe, coordinated by University of Vienna, Austria. This resource has special expertise in metallurgical research and had already begun to generate data on lead-free solder alloys.
ELFNET had identified the need for a new initiative in this area and in March 2005 it was agreed that this would be undertaken jointly with COST 531, led by Clemens Schmetterer at University of Vienna.
The SnAgCu alloy family was selected as the first priority based on its use as the predominant lead-free solder in the industry. The team worked to exhaustively review all available published data and some unpublished results, with particular efforts made to link data to accurate descriptions of the test methods used. 30 different compositions of the alloys have been described.
The data file is attached below:
RoHS_Database_pbfree_solder.pdf (4mb)
This page uses material from the Dionics website “RoHS Directives".
